EMERSON AND CUMING - ICI

Core Business

Design and production of encapsulant, adhesive, and thermal management protection items

For over 50 years, Emerson and Cumingís focus has been on designing and manufacturing high performance solutions for industries around the world. Our expansive breadth of encapsulant, adhesive, and thermal management technologies combined with our decades of experience allow us to create solutions to difficult engineering challenges, providing maximum design latitude for our customers. Our vision is to be your first choice for circuit and component assembly solutions. Products have been engineered to protect critical electronic components from harsh operating environments. Based on epoxy, polyurethane and silicone chemistries, we are capable of a broad range of solutions regardless of the application specifications.

Adhesives Individually formulated one and two component adhesives to bond, seal, and pot electronic assemblies Chip on Board Epoxy and silicone encapsulants specially formulated to perform on epoxy glass, polyimide, polyester or ceramic substrates Conformal Coatings One-component, urethane, silicone or acrylate coatings providing environmental protection for assembled circuits and electronic components Conductive Adhesive/ Solder Replacement A complete line of highly conductive, high-purity, one-component electrically conductive adhesives as solder alternatives Die Attach Adhesives Pre-mixed and frozen conductive adhesives and nonconductive adhesives for bonding integrated circuits directly onto the board Encapsulants One- and two-component encapsulants formulated from epoxy, polyurethane, acrylate and silicone chemistries Film Adhesives Allow components and parts to be bonded where pastes may not be optimal for large component assembly Flip Chip Underfills Highly flowable, high-purity, one-component encapsulants that form a uniform and void-free underfill layer Solder Alternatives Easy-to-use polymeric alternatives for solder with advanced adhesive paste that meet the electrical, thermal and mechanical requirements of solder Surface Mount Adhesives A broad range of ahhesives for circuit assembly, designed for high seringe dispensing, stencil printing or pin transfer applicationsThermal Management A complete line of thermal management interface materials and the real world applications expertise to help you design a thermal management solution

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